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https://issues.jboss.org/browse/TEIID-2826?page=com.atlassian.jira.plugin...
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Steven Hawkins commented on TEIID-2826:
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Just to make sure we're on the same page, the current state simply produces a module
with the root being the logical module root org.teiid etc. It's the as kit logic that
introduces system/layers/base - I don't think we want that level of knowledge in each
of the module builds. If we need to have it that path profile based, that should be easy
to do.
Beyond that it seems that your concern is that the EAP/product kit may be different than
the community one at an even more granular level. That is a possibility - and one that we
have yet to account for even with some current variations (the product security properties
files come to mind). If you want to future proof the project directories for that, it
should be fine. But at least initially it seems like the module artifacts we're
producing should be applicable to both deployments.
Change build to use zip translator packaging when building jboss kit
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Key: TEIID-2826
URL:
https://issues.jboss.org/browse/TEIID-2826
Project: Teiid
Issue Type: Sub-task
Components: Build/Kits
Affects Versions: 8.7
Reporter: Van Halbert
Assignee: Steven Hawkins
Change build to use zip translator packaging when building jboss kit
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